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Cooling of Electronics is becoming increasingly important
as form factors of electronic equipment continue to shrink
and power dissipation per unit volume is increasing due to
the boost in processing power that prevails in all
electronic applications. Furthermore, forced cooling is
hardly acceptable for consumer electronics products. As
thermal design aims to fulfill all thermal product
specifications in all conditions of consumer use; the need
for managing the thermal behavior of such products is
obvious.
Our cooling consultants have experience with a wide-range
of consumer and industrial electronics products and provide
you with the necessary support in both design as well as
analysis of the thermal behavior of products.
 Also
here it is of paramount importance to involve cooling
consultants already in the architectural / conceptual phases
of the product lifecycle. Very advanced simulation tools
such as FLOTHERM are available to assess and evaluate
architecture and design choices and to predict the thermal
behavior of the product. In addition an advanced suite of
measurement equipment is available to analyze the thermal
characteristics of prototypes and final products. Not only
is this necessary to verify whether products exhibit
acceptable temperatures compared to their limits, but test
and measurements are also required for validating the
computerized models.
One should also realize that cooperation in the conceptual and
design phases of Cooling and EMC consultants is necessary to achieve
optimal trade offs between various design choices. Our approach
can be characterized by basic problem resolution via an integral
design approach avoiding sub-optimization between experts.
Activities
Our thermal services focus on the following activities during the
product creation process regarding thermal behavior of electronics,
airflow (cooling) or noise analysis:
Concept/design phase
Activities with a longer time horizon, like architectural
analysis, concept and design review, simulation of concepts
(system/cabinet, board and component level)
Design/realization phase
Activities with relatively short time horizon, like, co-design,
design review, simulation, and measurement of model or product
with infrared camera and/or thermocouples, trouble shooting.
Generic capabilities
Management of thermal projects, benchmark competitor products,
training.
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For more information please contact:
Ger Jansen -
Office phone: +31 40 27 48463
Office fax: +31 40 27 46333
E-mail:
g.l.m.jansen@philips.com
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