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What’s your semiconductor innovation
challenge? Faster design, testing or production? Greater
accuracy, lower costs, higher yields or dealing with increasing
complexity? From lithography systems to packaged semiconductor
devices ready for market, Philips Applied Technologies helps
equipment manufacturers and semiconductor device companies
to solve complex technical problems and innovate faster.
Accelerate your innovation and improve your competitiveness
by tapping into our 40 years of experience in bringing
innovations to market. Draw on the know-how of the 70+
technology and process competences we combine in house.
Talk to us about your specific needs. We’re ready to
listen and act. Working closely with you to create integral
and practical solutions, we’ll bring innovation, technology
and ‘hands on’ expertise at every step – from ideation
to
industrialization, prototyping to supply chain support.
Whether you are a start-up, mid-size company or multinational
market leader, we offer the right mix of competences
from our broad and deep resource pool of multi-discipline
professionals, processes, technologies and equipment.
Philips Applied Technologies, bringing your semiconductors
ideas to life fast.
Connecting throughout the value chain to speed time
to market
The semiconductor world is changing fast.
Miniaturization is driving us continually onward, with feature
sizes getting ever smaller. The rise of convergent, function-rich
electronic devices like today’s cellular phones are leading
to ‘More than Moore’ – the shift in focus from transistor
density to system integration.
At the same time, the supply chain is becoming increasingly
specialized as knowledge is moving to different parts
of the chain.
So, whether you are an equipment supplier in fabrication
or assembly, a design house or an IC manufacturer, to
create solutions for tomorrow you need to see the bigger
picture.
That’s where Philips Applied Technologies brings its
unique insights and problem solving. By understanding
the entire value chain, we help design better products
that fit seamlessly in this chain. In manufacturing
equipment, assembly equipment, system design or applications,
we can bridge knowledge gaps and translate your requirements
into practical solutions.
Accelerating innovations from equipment
to applications
Philips Applied Technologies, your ideal innovation
partner!
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Proven track record in technical problem solving
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Ability to leverage know-how and synergies across
a huge range of technologies and numerous industries
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A knowledgeable outside perspective on your business
and technologies
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Flexibility for your R&D budget
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A way to ramp capacity up or down quickly and
with no fuss
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Access to a global network of experts and organizations
engaged in open and collaborative innovation
Breakthrough equipment development
The constant trend to decreasing feature
sizes, with ever more features and interconnects packed
on each IC, puts big demands on production and test equipment.
We help you create complex equipment that can build today’s
densely packed devices, from wafer to package, with all
necessary facilities and competences in-house.
We also work with you to ensure your equipment delivers
higher throughput and yields, so your products compete
strongly on speed, accuracy, quality and total cost
of ownership.
What we offer:
- First-of-a-kind equipment design
- Optimization of existing equipment for speed,
accuracy and costs
- Supply chain management
- Re-engineering
- Complex problem solving
- First time right development
Competences
- Nano precision control
- Machine dynamics & control
- System architecture & system design
- Embedded software
- Modeling
- Thermal management
- Vision
- Vacuum
- Tribology
- Power electronics
- Sensors & actuators
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Co-development of breakthrough
solutions for lithography systems |
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Developed the sensor system
for accurately positioning of a magnetic levitation
stage |
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Design, realization, installation
and run-in of a new butting line, helping our customers
reach their volume growth objectives |
Solving complex semiconductor packaging issues
Device makers also face the miniaturization
challenge. For today’s applications, chips must integrate
ever-more functionality, often with greater complexity –
for instance, including not just electrical interfaces,
but also mechanical and optical interfaces – and in ever
smaller packages.
In this environment, our breadth of competences gives
you a powerful advantage whatever your challenge. From
tackling thermal problems related to System-in-Package
(SiP) design to complex issues of highly dense interconnects
and/or multiple interfaces, our understanding of the
entire production chain bridges knowledge gaps and enables
innovative solutions, fast.
What we do
- Package design – concepts, first-of-a-kind
- System in Package design – components, multi-chip
modules
- System integration
- High performance interconnect
- Electrical/optical/mechanical interfaces
- Quality & reliability management
- Prototyping
Competences
- System architecture
- Platform architecture
- Embedded software
- Materials engineering
- Thermal management
- Thermo-mechanical analysis
- Virtual prototyping
- Modeling
- Reliability engineering
- Reliability testing
- MC simulation & testing
- Thin film processing
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Achieved higher integration
density and lower manufacturing costs for MEMS-based
processes for manufacture of inkjet devices |
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Developed
a simulation model to predict die crack risks in
packages |
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Created a smart LED engine
prototype featuring an integrated multi-color LED
module, an ASIC and packaging |
Moving to MEMS
‘More than Moore’ and growing demand for MEMS creates
opportunities but also demands new skills and know-how.
Our advanced competences can help you make rapid advances
in this growing field.
- MEMS design
- (Micro) mechanical engineering
- Micro-fluidics
- Electronic assembly
Turning semiconductor innovation into meaningful applications
We have extensive experience in applications
which call on advanced semiconductor technologies – from
micro-fluidics and MEMS-based devices to the latest in high-definition
TV and optical media recording. As a result, we understand
consumer expectations and needs in these areas. And we can
feed this understanding into projects at the semiconductor
design and production level to accelerate meaningful device
innovations.
Also, as the environment around us becomes more intelligent,
we understand what application developers need from
semiconductor devices, including sensors, actuators
and the connection between macro- and micro-mechanical
devices. That helps us support companies making the
switch from devices to intelligent systems in the home,
vehicles, professional environments and on the go.
Application areas
- Home electronics
- Displays
- Embedded software
- Connectivity
- Healthcare
- Energy
- Home & Building Automation
- Energy efficient lighting
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left: |
Developed technologies
for a hotel chain which provides visitors with an
intelligent environment that can be personalized
at the touch of a button |
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Used our expertise to define
the HDMI CEC (Consumer Electronic Control) protocol
and developed one of the world’s first implementations
for which we received a Grammy Award |
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Miniaturized the electronics
and mechanics to realize the first prototypes for
an intelligent, electronic pill |
For contact and information,
click here.
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